How to join the LSBI?

The LSBI is a multidisciplinary, hands-on lab where researchers evolve from the cleanroom to the surgery theater and robotic platforms.  The group hosts engineers, materials scientists, cell biologists and physicists who are driven by scientific curiosity, enjoy collaborative work, and are looking for a truly interdisciplinary program.

The LSBI is hosted at EPFL Campus Biotech in Geneva.

Students applying to the lab MUST fulfill one of these requirements:

registered EPFL bachelor and master students:

If you are looking to join the lab for a semester project, or a master thesis, you should organise your agenda to be on site, in Geneva, for at least a full day per week.

Travel costs between EPFL Lausanne and EPFL Geneva will be covered.

external students from a partner University:

to join the LSBI, you should register first through EPFL Academic service and check the following website for Exchange program.

List of partner universities: https://sac.epgl/ch/partner-universities-IN

external students from a non-partner University:

you are welcome to apply to join the LSBI, but you will need to find your own funding source e.g. a scholarship, a grant, etc.

JOB OPPORTUNITY

none at present.

PhD positions

The LSBI welcomes applications for PhD students motivated by multidisciplinary research in Neuroprosthetic Technology.

Internships & Projects

***NEW***   for SPRING 2018
SEMESTER PROJECTS OR MASTER THESIS
 

1. Technology optimisation and characterization bench for soft neural implants

The LSBI manufactures bioelectronic interfaces by patterning thin film metallization onto silicone elastomer substrates. Our systems comprise of several technological components, including a soft carrier material, stretchable metallization, electrode coatings on active sites, wiring, etc.

We are currently looking for motivated students that could bring in skills and motivation to help us achieve the following goals.

  • Build a lab test bench to characterise the longevity and reliability of our spinal cord implants by combining several stress mechanisms in a single setup. The student will work side by side our main engineer to assemble and test the equipment.
  • Develop an improved process for the fabrication of implants. The student will work on process integration of some modifications in our fabrication process flow. The work will be carried out mostly in the cleanroom, with some characterisation steps required to validate the manufacturing results.
  • Characterise new multilayered stretchable devices for reliability. The student will work on the fabrication of test devices and on their electromechanical characterisation over time.

The envisaged work will involve using the laboratory’s tools and practical contribution to design, processing, assembly and testing is expected.

Must-have competencies:
• general knowledge in microengineering and electrical characterization
• independence and motivation

Nice-to-have competencies:
• hands-on experience on cleanroom technology
• concise and effective reporting
• knowledge in materials science

To apply: contact Giuseppe Schiavone, giuseppe.schiavone@epfl.ch
 
2. Microfabrication and Characterization of implantable electrodes
 
We have developed a hybrid technology integrating plastics, elastomers and thin metal films to manufacture ultra-compliant microelectrode arrays.  The project will contribute to the optimization of the implant process flow and/or perform the electrical, mechanical and electrochemical characterization of the microelectrodes in vitro. 
 
Must have skills:
-general knowledge in engineering
-basic knowledge in microfabrication
-be independent, motivated and curious
 
Nice to have skills:
-hands-on experience with microfabrication
-general knwoledge in chemistry and / or materials science
 
To apply: contact Nicolas Vachicouras, nicolas.vachicouras@epfl.ch
 
3. Soft, hybrid neural implants
 
project suitable for a Master thesis
 
Neural implants are devices aimed at partially restoring neural functions for patients who suffer from various disabilities, such as paralysis, blindness or Parkinson’s. The LSBI has an established technology to fabricate such neural implants using soft and stretchable thin-film electronics. Next generation neuroprostheses require even closer integration of active electronics with the neural system.
 
The aim of this project is to help integrating active electronics directly onto the neural implant in order to improve its performance and increase its capabilities to record and stimulate the nervous system.
During the project, the student will fabricate devices in the cleanroom, characterize them in vitro and potentially in animal models.
 
Must-have competencies:
• general knowledge in materials science, mechanics, electrical engineering, cleanroom technology
• independence and motivation
 
Nice-to-have competencies:
• hands-on experience with cleanroom technologies
• hands-on experience in building basic electrical circuits (eg. design or prototyping)
• previous experience on multidisciplinary projects
 
To apply: contact Florian Fallegger, florian.fallegger@epfl.ch
 

4. Integrating PCB/electronics in soft materials (Winter/Spring 2018)

The LSBI has an expertise in the integration of hard and soft components, focused on millimeter components. We are now looking to improve upon these processes by generalizing the processing, creating a library of compatible materials and creating design rules for these tasks. This work can be pursued as either a master’s thesis or semester project. See here for technology introduction.

Must have:

  • Previous coursework related to materials and/or adhesion
  • General understanding of mechanics
  • Curiosity and willing-to-try-anything mentality
  • Methodical note-taking skills

Nice to have:

  • Previous lab experience
  • Coursework in adhesion/surface energy chemistry

Contact with brief motivation statement and CV, highlighting previous related experience/coursework: Aaron Gerratt, aaron.gerratt@epfl.ch

5. Multilayer soft electronics (Winter/Spring 2018)

The LSBI is a pioneer in stretchable electronics. Previously, work has focused on single layer devices, and a remaining challenge is simplifying the process of manufacturing multilayer structures. Your task will be to leverage brand new equipment in the lab to examine new ways of manufacturing multilayer stretchable electronic devices. This work can be pursued as either a master’s thesis or semester project. See here for technology introduction.

Must have:

  • General understanding of mechanics and materials
  • Curiosity and willing-to-try-anything mentality
  • Methodical note-taking skills

Nice to have:

  • Previous lab experience

Contact with brief motivation statement and CV, highlighting previous related experience/coursework: Aaron Gerratt, aaron.gerratt@epfl.ch

6. Injection molding technologies for soft electronics (Winter/Spring 2018)

LSBI is pushing the boundaries of stretchable electronics through scientific and engineering innovation. Our new technologies require new means of manufacturing and ongoing work is expanding into injection molding. You will design molds for both test structures and functional devices, create a library of materials for injection, and develop processes, design rules, and recipes for the entire injection molding process from mold conception to demolding of final devices. This work can be pursued as either a master’s thesis or semester project. See here for technology introduction.

Must have:

  • Previous coursework related to manufacturing and/or injection molding
  • Curiosity and willing-to-try-anything mentality
  • Methodical note-taking skills

Nice to have:

  • Previous hands-on experience with injection molding

Contact with brief motivation statement and CV, highlighting previous related experience/coursework: Aaron Gerratt, aaron.gerratt@epfl.ch